Why it matters: It's full steam ahead for Intel's next big manufacturing node as the chip giant provides an encouraging update on its 18A (1.8nm-class) fabrication process. This advanced node is a crucial component of Intel's foundry ambitions, allowing it to produce more efficient chips for third-party customers and, of course, its own processors.
The company reiterated that it already released version 1.0 of the process design kit (PDK) for 18A to partners in July, enabling them to kickstart the development of chips using this cutting-edge manufacturing tech. But the more exciting news is Intel revealing that two of its own products leveraging 18A have successfully booted operating systems.
The news comes from Kevin O'Buckley, Intel's SVP and GM of Foundry Services, who reported that the Panther Lake client processor has powered on and is booting Windows. He added that it's yielding well and already in use inside Intel. Clearwater Forest for data centers has also powered on, is booting operating systems, and is "performing well."
Both achieved this milestone less than two quarters after taping out, keeping them on schedule to enter production in 2025.
"We are pioneering multiple systems foundry technologies for the AI era and delivering a full stack of innovation that's essential to the next generation of products for Intel and our foundry customers," said O'Buckley. "We are encouraged by our progress and are working closely with customers to bring Intel 18A to market in 2025."
The 18A process is special for multiple reasons. It features Intel's RibbonFET gate-all-around architecture which increases transistor performance. But just as pivotal is PowerVia, a backside power delivery system that is particularly beneficial for power-hungry data center chips.
By successfully implementing both RibbonFET and PowerVia, Intel claims to have pulled off an industry first for a foundry offering. Combined with its packaging tech and manufacturing capacity, Intel Foundry Services now has all the ingredients to produce the AI processors of the future.
Interest in 18A seems high, too. Not only have EDA and IP partners updated their tools for the PDK 1.0 release, but Intel claims external foundry customers are already actively designing chips on the node.
That's understandable given the benefits. The process refines RibbonFET with additional optimizations, promising a roughly 10% performance-per-watt uplift over the previous 20A node. Some believe this recipe of RibbonFETs and PowerVia may even allow 18A to outmuscle the upcoming 3nm and 2nm nodes from TSMC in certain workloads when it rolls out next year, though real-world products will be the proving ground.
All said, with working silicon already booting on 18A ahead of schedule, Intel's transition to next-gen lithography is making steady, impressive progress.